Automated Monitoring of Airborne Molecular Contamination (AMC)
The all-in-one analyzer for FOUP, fab and clean-room environment AMC monitoring in the semiconductor industry.
AMC-Monitor T-1000 Overview
The AMC-Monitor is a modular and flexible platform for Airborne Molecular Contaminations (AMC) monitoring in semiconductor applications such as:
- FOUP analysis with a focus on VOC and condensables incl. full integration with Pfeiffer Vacuum APA 302 pod analyzer.
- Clean-room monitoring in fabrication plants: automated detection of AMC at multiple sampling points with an integrated multiplexing system, directly in the fab at variable locations and even at the tool-level. Optionally fully integrated aboard the Pfeiffer Vacuum AMPC fab analyzer.
- Monitoring of outside and intake air: automated fence line monitoring incl. alarm levels, up- and downstream filter testing.
The custom-made analyzer is based on the most suitable IONICON PTR-TOFMS series instrument for the particular application and the Automated Measurement and Evaluation AME software suite with pre-set recipes for your monitoring challenge. The scalable multiplexing solution minimizes analysis costs per sampling point.
Expect these benefits in combination with the advantages only a time-of-flight (TOF) based analyzer offers:
- incredible speed
- high sensitivity
- enhanced separation for complex samples.
The IONICON AMC-Monitor is the ideal tool for current and future challenges in the semiconductor industry.
AMC-Monitor T-1000 Features and Benefits
Loaded with…
- Several soft chemical ionization modes – wide component range
- Renowned PTR-MS and SRI-MS technology
- AME monitoring solution software
- Enhanced separation, identification and quantification capabilities
- Full mass spectral analysis in a split second
- On-line LOD (limit of detection) < 1 pptv
- Response time below 100 ms
- On-board multiplexing (multiple sampling lines) and calibration
Expect this…
- Simultaneous quantification of several hundred substances in real-time
- Pre-set expert recipes to choose from for the analysis of target species
- Simple graphical user interface
- Clean-room AMC monitoring, filter tests, fence-line and supply air monitoring
- FOUP contaminations detection integrated with Pfeiffer Vacuum APA 302 pod analyzer
- Industrial integration via Modbus TCP
- Remote control and data reporting
- Fit for future updates and upgrades
- Stand-alone or optional integration with Pfeiffer Vacuum AMPC systems
AMC-Monitoring Applications
FOUP monitoring
Analysis of AMC contamination in FOUP – focus on VOC and condensables. Full integration with Pfeiffer Vacuum APA 302 pod analyzer available.
Typical relevant substances:
- Acetone
- IPA
- Toluene
- CNF / PFTBA
- COF
- MEK
- PGME
Fab clean-room monitoring
Automated monitoring of AMC at multiple sampling points. Full integration with Pfeiffer Vacuum AMPC systems available.
Typical relevant substances:
- Trimethylsilanol, HMDSO
- PGMEA, PGME
- Siloxanes
- Acetic Acid
- Ethyl Acetate, Ethyl Lactate
- BTEX
- Chloro-carbons
- Perfluoro-carbons
Monitoring of outside air
Automated fence line monitoring incl. alarm levels.
Typical relevant substances:
- Organic acids (e.g. acetic acid, formic acid)
- Aldehydes, Ketones, Glycolic compounds
- Pyrolysis Products from biomass burn
- VOC & Condensables (sticky compounds)
Sulfur compounds
- H2S,
- Mercaptans,
- Thioethers
Nitrogen containing compounds
- Acetonitrile (biomass burning)
- NH3,
- Amines
Contact us for your individual AMC-Monitor solution!
Suggested further reading
Coquand, C., Borde, Y. (2024).
Monitoring of the airborne molecular contamination (AMC) in a semiconductor factory with a PTR-TOF-MS
Contributions to the 9th Int. Conf. on PTR-MS, p. 114–118
Herbig, J., Winkler, K., Herburger, A., Schober, C. (2024).
From Lab to Fab - Enhancing PTR-TOF for Industrial Monitoring
Contributions to the 9th Int. Conf. on PTR-MS, p. 119–123
Kenis, K., Mertens, P., Altamirano-Sanchez, E., Van Ongeval, J. De Vita, M. (imec, Pfeiffer Vacuum) (2023).
Monitoring of Trace Molecular Impurities in Clean-Room Air
Solid State Phenomena, Vol. 346, p. 183–188. DOI: 10.4028/p-BH3umg
Pic, N., Martin, C., Vitalis, M., Calarnou, T., Camlay, D., Grosjean, C., Lanier, A., Kames, J., Acksel, A., Galvez, C. (SPIE, Bellingham, WA 2010) 76380M.
Defectivity decrease in the photolithography process by AMC level reduction through implementation of novel filtration and monitoring solutions
Metrology, Inspection, and Process Control for Microlithography XXIV, edited by Christopher J. Raymond, Proceedings of SPIE Vol. 7638
